Specification | Unit | Details |
---|---|---|
Wafer Diameter | mm | 6 & 8 / 8 & 12 Auto Conversion |
Supportable Tape | - | UV Dicing Tape |
WPH | wfh | 100 (based on 12inch wafer) |
UV uniformity | % | ±10 (Lamp) |
Ring Frame Cassette | ea | 2 |
Machine dimensions (WxDxH) |
mm | 1,200 x 1,800 x 1,600 |
Machine weight | Kg | 800 (approx.) |
Controller & GUI | - | PLC & PC |
Clean Room Level | Class | 1,000 |
Noise Level | db | 80 or less |
Power | - | 220V, 3 Pulse, 30A, 60 Hz |
CDA | EA | 3 (0.5Mpa, Φ12 tube) |
N2 | EA | 1 (0.3Mpa, Φ12 tube) |