Semiconductor Equipment
Detaper
| Specification | Unit | Details |
|---|---|---|
| Wafer Diameter | mm | 6 & 8 / 8 & 12 Auto Conversion |
| Wafer Thickness | µm | 6 & 8inch : 150~ 12 inch : 200~ |
| Supportable Tape | - | Normal BG Tape, UV BG Tape, Bump BG Tape |
| WPH | wfh | 55 (based on 12inch wafer) |
| Wafer Warpage | mm | ±5 |
| Wafer Cassette | ea | 2 |
| UV uniformity | % | ±10 (Lamp) |
| Machine dimensions (WxDxH) |
mm | 1,965 x 1770 x 1,650 |
| Machine weight | Kg | 1,600 (approx.) |
| Controller & GUI | - | PLC & PC |
| Clean Room Level | Class | 1,000 |
| Noise Level | db | 80 or less |
| Power | - | 220V, 3 Pulse, 30A, 60 Hz |
| CDA | EA | 6 (0.5Mpa, Φ12 tube) |
| N2 | EA | 1 (0.3Mpa, Φ12 tube) |