Semiconductor Equipment
Flip Mounter
| Specification | Unit | Details |
|---|---|---|
| Wafer Diameter | mm | 8 & 12 Auto Conversion |
| Wafer Thickness | µm | 8 inch : 150~ 12 inch : 200~ |
| Supportable Tape | - | Dicing Tape (UV, Non-UV) |
| WPH | wfh | Re mount : >25 Flip mount : >20 |
| Wafer Warpage | mm | ±5 |
| Ring Frame Cassette | ea | 4 |
| UV uniformity | % | ±10 (Lamp) |
| Machine dimensions (WxDxH) |
mm | 3,120 x 2,230 x 2,000 |
| Machine weight | Kg | 1,600 (approx.) |
| Controller & GUI | - | PLC & PC |
| Clean Room Level | Class | 1,000 |
| Noise Level | db | 80 or less |
| Power | - | 220V, 3 Pulse, 30A, 60 Hz |
| CDA | EA | 5 (0.5Mpa, Φ12 tube) |
| N2 | EA | 1 (0.3Mpa, Φ12 tube) |